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In this episode of the Global Medical Device Podcast, Etienne Nichols sits down with Leo Eisner, founder of Eisner Safety Consultants and a leading voice in IEC 60601 standards development. We unpack the upcoming revisions to IEC 60601, 4th ed.,
Free presentation in London 
— With Leo Eisner, The60601Guy, & Ian Sealey
𝗪𝗵𝗮𝘁’𝘀 𝗼𝗻 𝘁𝗵𝗲 𝗺𝗲𝗻𝘂
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• Some 𝗳𝘂𝘁𝘂𝗿𝗲 𝗿𝗲𝗾𝘂𝗶𝗿𝗲𝗺𝗲𝗻𝘁𝘀 of IEC60601-1 , 4th being considered you 𝙢𝙖𝙮 𝙣𝙤𝙩 𝙚𝙭𝙥𝙚𝙘𝙩:
Gas Pathways,
Cleaning,
Disinfection,
AI/ML,
Voice Input/Output,
Adhesives for Applied Parts,
PPE,
and so much more….
• IEC60601-1 , 4th Ed.
• Applicable Standards
• Future Proofing Test Plans
I’m excited to be joining this event with Naveen Agarwal, Ph.D. on the next Let’s Talk Risk episode on Sept 6, 11:00 -11:30AM EDT our discussions I’m sure will be interesting talking about my work in the development of 4th ed of IEC 60601-1 and so much more.
Naveen likes to talk about Guest Speaker’s career’s and how they got to where they are. So, it is possible this topic may come up. You can see much of my career information by going to Leo Eisner’s LinkedIn Profile.
Learn from an 𝗶𝗻𝘀𝗶𝗱𝗲𝗿 𝗰𝗼𝗺𝗺𝗶𝘁𝘁𝗲𝗲 𝗺𝗲𝗺𝗯𝗲𝗿 that wrote portions of 𝗜𝗘𝗖 𝟲𝟬𝟲𝟬𝟭-𝟭, 𝗲𝗱 𝟯.𝟮 𝗔𝗺𝗲𝗻𝗱𝗺𝗲𝗻𝘁𝘀 and is involved in the development of the Fourth Edition of IEC 60601-1. If you want to learn about these updates to the standard and the IEC 60601 Amendments Project – You’re in luck – Leonard (Leo) Eisner the “𝗜𝗘𝗖 𝟲𝟬𝟲𝟬𝟭 𝗚𝘂𝘆” from Eisner Safety Consultants partnered with Holly Rossington of BSI to present the webinar “Leveraging the CB Scheme: A Guide for North American Medical Device Manufacturers”
Webinar: Leveraging the CB Scheme: A Guide for North American Medical Device Manufacturers
When: Tuesday, June 25, 2024
Time: 11:00 a.m – 12:00 p.m. EDT
About the Event: Join BSI & Leo Eisner for an insightful webinar that explores how North American medical device manufacturers can harness the power of the CB Scheme to enhance their global market access. Leo the “IEC 60601-1 Guy” will be presenting on the significant updates introduced in the latest edition of IEC 60601-1 Ed. 3.2, which will impact medical device manufacturers.